B1504: 1.50mm Pitch Connector Board to Board
Product Features
The B1504 series is a 1.50mm pitch board-to-board connector, specifically designed for mid-to-high-end LED/LCD TV backlight modules. Key advantages include ultra-narrow 1.5mm pitch, 3-pin multi-circuit transmission, 90° horizontal SMT layout, high-voltage resistance, multi-signal protection, and dedicated adaptation for mid-to-high-end backlight applications, focusing on dual-circuit "power + detection" scenarios.
1.5mm Ultra-Narrow Pitch & 3-Pin Design
Supports simultaneous transmission of backlight power and brightness / temperature detection signals, enhancing dynamic picture quality adjustment and meeting functional upgrade requirements of mid-to-high-end models.
01
90° Horizontal SMT Layout
Minimizes vertical height, supporting ultra-thin TV designs and improving PCB space utilization.
02
High Voltage & Insulation
Rated at 1000V with ≥1000 MΩ insulation resistance, protecting both power and signal circuits from surges and electromagnetic interference, ensuring stable brightness and signal reliability.
03
Reliable Materials & Low Contact Resistance
Housing made from LCP UL94V-0 flame-retardant plastic; terminals made of phosphor bronze with tin plating. Contact resistance ≤20 mΩ, with anti-misinsertion positioning grooves to prevent assembly errors.
04
Product Specification
|
Pitch |
1.5mm |
|
Rated Current |
1A AC/DC |
|
Rated Voltage |
150V AC/DC |
|
Insulation Resistance |
≥1000MΩ |
|
Contact Resistance |
≤20mΩ |
|
Withstand Voltage |
1000V AC/minute |
|
Temperature Range |
-25℃ ～ +105℃ |
Application Scenarios
The B1504 series is ideal for mid-to-high-end backlight modules and dual-circuit "power + detection" applications:
• Mid-to-High-End LED/LCD TVs & Mini LED Backlights: Supports ultra-thin design and precise light control for high-picture-quality displays.
• High-End Commercial Displays: Conference tablets, gaming monitors, and other devices requiring accurate color reproduction and dynamic brightness adjustment.
• Multi-Brand Compatibility: Standardized design compatible with multiple backlight module brands, eliminating the need for custom molds.
• Automated Assembly & After-Sales Repair: Horizontal SMT layout supports automated production lines. Connectors can be used as dedicated replacement parts for high-end TV backlight failures, restoring dual-circuit functionality without replacing the entire module, reducing repair costs.
Production Process
Dual-branch parallel production:
- Copper Strip Branch: High-precision stamping and standardized electroplating.
- Injection Molding Branch: Strict control over dimensions, structural integrity, and surface finish of LCP/PA66 components.
Subsequent automated processes include pin assembly, CCD visual inspection, tape packaging, and full-process final inspection, ensuring consistent product quality.
Production Site
JKUN Connector's core production base covers all processes with precise division of labor:
Injection Molding Workshop
Automated equipment ensures dimensional and material accuracy for housings and components.
Stamping Workshop
Precision equipment completes copper strip stamping and supplies high-precision parts for electroplating.
Assembly Workshops
Automated production lines with integrated testing devices handle assembly and initial inspection of appearance and functionality.
The base ensures fully automated production, from raw materials to finished products, maintaining high efficiency, strict quality control, and stable delivery.
Packaging & Transportation
- Industry-standard packaging: Products placed in dedicated cartons and secured on pallets.
- Storage: Clean, dry, light-proof, low-humidity environment, retaining original packaging.
- Transportation: Flexible options including truck, international express, air, and sea freight. Packaging must be protected from sharp objects, impacts, and environmental hazards.
Authoritative Certification & Independent Patents
Certified under IATF16949, ISO9001, ISO14001, ISO45001, GB/T27922-2011.
Holds multiple utility model patents, focusing on connector structure optimization, wire harness process simplification, and precision assembly of terminals and housings.
These measures provide a core technological barrier and ensure stable, high-performance dual-circuit transmission.
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