High Density Board To Board Connectors

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High Density Board To Board Connectors
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Pitch: 3.00mm
The B3001 series is a 3.00mm pitch high-density board-to-board connector, specifically designed for LED/LCD TV backlight modules. Key features include a precise 3.0mm single-circuit power supply, 90° horizontal SMT layout, 1000V high-voltage protection, and compatibility with multiple module brands, ensuring stable connections for small and medium-sized backlight modules.
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Board-to-Board Connector
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Description

B3001: 3.00mm Pitch High Density Board to Board Connectors

 

Product Features

 

 

The B3001 series is a 3.00mm pitch high-density board-to-board connector, specifically designed for LED/LCD TV backlight modules. Key features include a precise 3.0mm single-circuit power supply, 90° horizontal SMT layout, 1000V high-voltage protection, and compatibility with multiple module brands, ensuring stable connections for small and medium-sized backlight modules.

product-1464-867

 

Compact & High-Density Design

3.0mm standardized pitch with 2-pin fixed holes meets single-channel power supply requirements, improving space utilization and reducing driver board footprint compared to wide-pitch connectors.

01

90° Horizontal SMT Layout

Both male and female connectors adopt a horizontal surface-mount design, minimizing vertical space and supporting thin, lightweight TV designs.

02

High Voltage & Insulation

Rated at 1000V AC/min with ≥1000 MΩ insulation resistance, protecting against instantaneous voltage surges and preventing black screens or flickering.

03

Low-Power Transmission

Rated current 1A, rated voltage 150V, with LCP/PA66 UL94V-0 flame-retardant housing and phosphor bronze tin-plated terminals. Contact resistance ≤20 mΩ ensures low-loss power transmission and long module lifespan.

04

 

Product Specification

 
product-700-257

Pitch

3.0mm

Rated Current

1A AC/DC

Rated Voltage

150V AC/DC

Insulation Resistance

≥1000MΩ

Contact Resistance

≤20mΩ

Withstand Voltage

1000V AC/minute

Temperature Range

-25℃ ~ +105℃

 

Application Scenarios

The B3001 series is ideal for various LED/LCD backlight module applications:

• Consumer Small & Medium TVs: Reduces driver board space, supports thinner designs, withstands voltage surges, and is compatible with multiple module brands.

• Mid-Range TV Models: Provides low-loss power supply, temperature resistance, and flame-retardant protection for improved reliability.

• Commercial Displays: Adapts to harsh industrial environments, offering wide temperature tolerance, vibration resistance, and compatibility with multiple module brands, reducing supply chain costs.

• Backlight Module Manufacturers: Compatible with automated production lines without separate mold tooling, improving production efficiency.

• After-Sales Maintenance: Faulty connectors can be quickly replaced, lowering repair time and costs.

• Automotive & Portable Displays: Supports compact layouts, temperature and vibration resistance, low power consumption, and multi-brand compatibility for extended battery life.

product-800-600

 

Production Process

 

 

Manufactured using a dual-branch parallel process:

  • Copper Strip Branch: High-precision stamping and standardized electroplating for robust terminals.
  • Injection Molding Branch: High-quality flame-retardant LCP/PA66 plastics processed simultaneously for housings and components.

Afterward, automated pin assembly, CCD visual inspection, tape-and-reel packaging, and full-process final inspection are performed to meet stringent automotive-grade quality standards.

Production process

Packaging & Transportation

 

 

Industrial-grade standardized packaging with anti-static, dustproof, and shock-absorbing inner packaging.

Securely sealed outer packaging, palletized, and stored in clean, dry, ventilated, and light-protected conditions.

Strict stacking limits and FIFO inventory management.

Flexible transportation options with emphasis on protection from impacts, sharp objects, and environmental hazards.

Package &Transportation

QA & QC

 

 

Comprehensive quality system covering quality, environmental, and industry-specific standards.

Authoritative certifications: IATF16949, ISO9001, ISO14001, UL/CUL, CE.

Full-chain quality control: incoming material inspection, real-time production monitoring, and final product testing ensure 100% compliance and product reliability.

certificate

 

 

 
Frequently Asked Questions
 
 

What is the MOQ for the B3001 high-density board-to-board connector?

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The MOQ depends on the selected part number, whether you require an individual connector or a matched pair, and the estimated order quantity. Please provide your required configuration and quantity, and we will confirm the applicable MOQ.

What is the standard lead time?

 

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Standard orders are completed within 7-10 days after order confirmation.

What information is needed to allocate the contacts?

 

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Provide the signal map, power and ground positions, circuit count and required board spacing.

Can the connector keep-out area be checked before PCB release?

 

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Yes. Send the PCB stack-up, connector coordinates, component clearances and mating direction.

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