B3001: 3.00mm Pitch High Density Board to Board Connectors
Product Features
The B3001 series is a 3.00mm pitch high-density board-to-board connector, specifically designed for LED/LCD TV backlight modules. Key features include a precise 3.0mm single-circuit power supply, 90° horizontal SMT layout, 1000V high-voltage protection, and compatibility with multiple module brands, ensuring stable connections for small and medium-sized backlight modules.

Compact & High-Density Design
3.0mm standardized pitch with 2-pin fixed holes meets single-channel power supply requirements, improving space utilization and reducing driver board footprint compared to wide-pitch connectors.
01
90° Horizontal SMT Layout
Both male and female connectors adopt a horizontal surface-mount design, minimizing vertical space and supporting thin, lightweight TV designs.
02
High Voltage & Insulation
Rated at 1000V AC/min with ≥1000 MΩ insulation resistance, protecting against instantaneous voltage surges and preventing black screens or flickering.
03
Low-Power Transmission
Rated current 1A, rated voltage 150V, with LCP/PA66 UL94V-0 flame-retardant housing and phosphor bronze tin-plated terminals. Contact resistance ≤20 mΩ ensures low-loss power transmission and long module lifespan.
04
Product Specification

|
Pitch |
3.0mm |
|
Rated Current |
1A AC/DC |
|
Rated Voltage |
150V AC/DC |
|
Insulation Resistance |
≥1000MΩ |
|
Contact Resistance |
≤20mΩ |
|
Withstand Voltage |
1000V AC/minute |
|
Temperature Range |
-25℃ ~ +105℃ |
Application Scenarios
The B3001 series is ideal for various LED/LCD backlight module applications:
• Consumer Small & Medium TVs: Reduces driver board space, supports thinner designs, withstands voltage surges, and is compatible with multiple module brands.
• Mid-Range TV Models: Provides low-loss power supply, temperature resistance, and flame-retardant protection for improved reliability.
• Commercial Displays: Adapts to harsh industrial environments, offering wide temperature tolerance, vibration resistance, and compatibility with multiple module brands, reducing supply chain costs.
• Backlight Module Manufacturers: Compatible with automated production lines without separate mold tooling, improving production efficiency.
• After-Sales Maintenance: Faulty connectors can be quickly replaced, lowering repair time and costs.
• Automotive & Portable Displays: Supports compact layouts, temperature and vibration resistance, low power consumption, and multi-brand compatibility for extended battery life.

Production Process
Manufactured using a dual-branch parallel process:
- Copper Strip Branch: High-precision stamping and standardized electroplating for robust terminals.
- Injection Molding Branch: High-quality flame-retardant LCP/PA66 plastics processed simultaneously for housings and components.
Afterward, automated pin assembly, CCD visual inspection, tape-and-reel packaging, and full-process final inspection are performed to meet stringent automotive-grade quality standards.

Packaging & Transportation
Industrial-grade standardized packaging with anti-static, dustproof, and shock-absorbing inner packaging.
Securely sealed outer packaging, palletized, and stored in clean, dry, ventilated, and light-protected conditions.
Strict stacking limits and FIFO inventory management.
Flexible transportation options with emphasis on protection from impacts, sharp objects, and environmental hazards.

QA & QC
Comprehensive quality system covering quality, environmental, and industry-specific standards.
Authoritative certifications: IATF16949, ISO9001, ISO14001, UL/CUL, CE.
Full-chain quality control: incoming material inspection, real-time production monitoring, and final product testing ensure 100% compliance and product reliability.

Frequently Asked Questions
What is the MOQ for the B3001 high-density board-to-board connector?
-
The MOQ depends on the selected part number, whether you require an individual connector or a matched pair, and the estimated order quantity. Please provide your required configuration and quantity, and we will confirm the applicable MOQ.
What is the standard lead time?
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Standard orders are completed within 7-10 days after order confirmation.
What information is needed to allocate the contacts?
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Provide the signal map, power and ground positions, circuit count and required board spacing.
Can the connector keep-out area be checked before PCB release?
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Yes. Send the PCB stack-up, connector coordinates, component clearances and mating direction.
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